Recent Development of Si Chemical Dry Etching Technologies
نویسندگان
چکیده
منابع مشابه
Optical photoresponse of CuS-n-Si radial heterojunction with Si nanocone arrays fabricated by chemical etching.
The paper deals with the fabrication of a p-CuS-n-Si nanocone heterojunction based highly sensitive broad band photodetector. Cone-like one dimensional Si nanostructures formed by metal assisted chemical etching, with superior antireflection characteristics have been used as templates for fabrication of the heterojunction. Covellite CuS material was synthesized by a simple chemical reaction for...
متن کاملDry etching and sputtering.
Dry etching is an important process for micro- and nanofabrication. Sputtering effects can arise in two contexts within a dry-etch process. Incoming ions cause removal of volatile products that arise from the interaction between the dry-etch plasma and the surface to be etched. Also, the momentum transfer of an incoming ion can cause direct removal of the material to be etched, which is undesir...
متن کاملDry Etching Based Silicon Micromachining
The aim of this work is to demonstrate the “dry” etching based micro-fabrication technologies in the manufacturing of Single Crystal Silicon (SCS) for Micro-Electro/(Optical)-Mechanical-Systems (ME(O)MS). The ME(O)MS technology is very fast growing industry branch based often on the same silicon technology as integrated circuits. The process of plasma-dry etching is quite simple straightforward...
متن کاملDry Etching Technologies of Optical Device and III-V Compound Semiconductors
Dry etching is one of the elemental technologies for the fabrication of optical devices. In order to obtain the desired shape using the dry etching process, it is necessary to understand the reactivity of the materials being used to plasma. In particular, III-V compound semiconductors have a multi-layered structure comprising a plurality of elements and thus it is important to first have a full...
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ژورنال
عنوان ژورنال: Journal of Nanomedicine & Nanotechnology
سال: 2013
ISSN: 2157-7439
DOI: 10.4172/2157-7439.s15-001